Facilities and Resources


First-principles Calculation

● Computaional Resources: OSU high performance computer cluster (see OSU HPC capabilities)

● Software: Vienna Ab Initio Simulation Package (VASP)



Thin Film Deposition

● Pulsed Laser Deposition (PLD): Our PLD system includes (1) KrF Excimer 248 nm laser for target ablation, (2) Neocera PLD vacuum chamber for oxide deposition, and (3) high-pressure RHEED system for in-situ monitoring of film growth.

● Targets for PLD will be fabricated using the bulk synthesis tools at OSU Advanced Technology and Manufacturing Institute (see OSU ATAMI capabilities)

● PLD chambers for sulfide deposition, sputtering deposition, thermal evaporation, e-beam evaporation, and chemical vapor deposition are available in OSU Materials Synthesis and Characterization Facility (see OSU MASC capabilities)



Thin Film Characterization

● Rigaku XRD facilities for thin-film and powder measurements (see OSU X-ray Diffraction Facilities)

● TEM, SEM, EDS and FIB are available in OSU Electron Microscopy Facility (see OSU Electron Microscopy Facility capabilities)

● AFM, PFM, and MFM are available for shared research facilities



Device Fabrication and Electrical Test

● Photolithography, plasema etch, and surface treatment tools in OSU cleanroom

● Four probe station with heated chuck

● Agilent Technologies Semiconductor Parameter Analyzer and Prevision LCR Meter for I-V, C-V, and pulse measurement

● Also see OSU cleanroom facilities